Copper Tungsten Plate
Physical Properties of Copper Tungsten Plate
| Properties | Density g/cm3 | Thermal Expansion Coefficient | Heat Conductivity w/(m·k) | Thermal Capacity J/(kg°C) | Modulus of Elasticity GPa | Poisson Density | Melting Point °C | Strength MPa |
|---|---|---|---|---|---|---|---|---|
| Tungsten | 19.32 | 4.5 | 174 | 136 | 411 | 0.28 | 3410 | 550 |
| Copper | 8.93 | 16.6 | 403 | 385 | 145 | 0.34 | 1083 | 120 |
Properties of Copper Tungsten Plate
| Item | Chemical composition % --Cu | Chemical composition %-Impurity | Chemical composition %-W | Density | TRS | Resistivity | Electric Conductivity | Hardness |
|---|---|---|---|---|---|---|---|---|
| WCu50 | 50±2.0 | ≤0.5 | allowance | 11.9-12.3 | 390 | ≤3.2 | ≥55 | 115 |
| WCu40 | 40±2.0 | ≤0.5 | allowance | 12.8-13.0 | 480 | ≤3.7 | ≥47 | 140 |
| WCu30 | 30±2.0 | ≤0.5 | allowance | 13.8-14.4 | 790 | ≤4.1 | ≥42 | 175 |
| WCu20 | 20±2.0 | ≤0.5 | allowance | 15.2-15.6 | 980 | ≤5.0 | ≥34 | 220 |
| WCu10 | 10±2.0 | ≤0.5 | allowance | 16.8-17.2 | 1160 | ≤6.5 | ≥27 | 260 |
| WCu7 | 7±2.0 | ≤0.5 | allowance | 17.3-17.8 | 1120 | ≤7.0 | ≥26 | 275 |